Sensor device

ABSTRACT

A sensor device may determine a first optical sensor value associated with a first displacement and a second optical sensor value associated with a second displacement, wherein the first displacement is between an emitter associated with the first optical sensor value and a sensing location used to determine the first optical sensor value, wherein the second displacement is between an emitter associated with the second optical sensor value and a sensing location used to determine the second optical sensor value, and wherein the first displacement is different from the second displacement. The sensor device may determine one or more measurements using the first optical sensor value and the second optical sensor value, wherein the one or more measurements relate to a first penetration depth associated with the first optical sensor value, and a second penetration depth associated with the second optical sensor value.

RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/831,308, filed Mar. 26, 2020 (now U.S. Pat. No. 11,131,584), entitled“SENSOR DEVICE,” which claims priority to U.S. Provisional PatentApplication No. 62/881,819, filed on Aug. 1, 2019, entitled “OPTICALSENSOR,” the contents of which are incorporated herein by reference intheir entireties.

BACKGROUND

A sensor device may be utilized to capture information for spectrometryanalysis. For example, the sensor device may capture informationrelating to a set of electromagnetic frequencies. The sensor device mayinclude a set of sensor elements (e.g., optical sensors, spectralsensors, and/or image sensors) that capture the information. Forexample, an array of sensor elements may be utilized to captureinformation relating to one or more frequencies. An analysis may beperformed on the information relating to the one or more frequencies todetermine spectrometry information.

SUMMARY

According to some implementations, a method may include determining afirst optical sensor value associated with a first displacement and asecond optical sensor value associated with a second displacement,wherein the first displacement is different from the seconddisplacement; determining one or more measurements using the firstoptical sensor value and the second optical sensor value, wherein theone or more measurements relate to a first penetration depth associatedwith the first optical sensor value, and a second penetration depthassociated with the second optical sensor value; and providinginformation identifying the one or more measurements.

According to some implementations, a sensor may include one or moreoptical sensors, and one or more processors configured to determine afirst optical sensor value and a second optical sensor value using theone or more optical sensors, wherein the first displacement is differentfrom the second displacement; determine one or more measurements usingthe first optical sensor value and the second optical sensor value,wherein the one or more measurements relate to a first penetration depthassociated with the first optical sensor value, and a second penetrationdepth associated with the second optical sensor value; and provideinformation identifying the one or more measurements.

According to some implementations, a device may include one or moreoptical sensors, and one or more processors, communicatively coupled tothe one or more optical sensors, configured to determine a first opticalsensor value and a second optical sensor value using the one or moreoptical sensors, wherein the first displacement is different from thesecond displacement; determine one or more measurements using the firstoptical sensor value and the second optical sensor value, wherein theone or more measurements relate to a first penetration depth associatedwith the first optical sensor value, and a second penetration depthassociated with the second optical sensor value; and provide informationidentifying the one or more measurements.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1-5 are diagrams of one or more example implementations describedherein.

FIG. 6 is a diagram of an example relationship between measurementpenetration depth and separation between a sensor and an emitter thatrelates to one or more example implementations described herein.

FIG. 7 is a diagram of an example environment in which systems and/ormethods described herein may be implemented.

FIG. 8 is a diagram of example components of one or more devices of FIG.7.

FIG. 9 is a flowchart of an example process for determining measurementsat two or more different measurement depths based on two or moreseparations between sensors and emitters.

DETAILED DESCRIPTION

The following detailed description of example implementations refers tothe accompanying drawings. The same reference numbers in differentdrawings may identify the same or similar elements. The followingdescription uses a spectrometer as an example. However, the calibrationprinciples, procedures, and methods described herein may be used withany sensor, including but not limited to other optical sensors andspectral sensors.

A structure of a measurement target may be composed of layers ofdifferent thicknesses. Examples of measurement targets include animaltissue, human tissue, a food item, an organic material, and/or the like.In the case of tissue, different tissue layers contain different typesof blood vessels, such as arteries, arterioles, capillaries, and veins.When performing non-intrusive optical measurements of vital signs, bloodflow through these different vessels indicates different information.For example, optically monitoring blood pressure is more accurate whenmeasuring blood flow from the deep arteries that exist in thesubcutaneous tissue. Measurement complications arise when acquiringspectra of blood flow through deeper layers of tissue (e.g.,subcutaneous tissue) because the signal becomes convoluted with signalsfrom the shallower layers (e.g., the dermis and/or epidermis).

A multi-distant approach, in which both deep and shallow layers areassessed, can produce more accurate measurements of blood flow in thedeeper vessels, resulting in significantly more accurate readingsrelative to a single-distant approach. More generally, it may bebeneficial to perform measurements at multiple different depths in ameasurement sample to determine different types of measurement values ora particular measurement value at two or more different depths. This maybe useful, for example, for spectral measurement of a measurement targetbased on interactance spectrometry. When performing spectralmeasurements of tissue in interactance mode, the penetration depth ofthe measured light may be based on a separation between an emitter and asensor. For example, as the separation increases, the sensor may measurelight that has penetrated to a greater penetration depth in themeasurement target. However, achieving multiple, different penetrationdepths using multiple different sensor devices associated withrespective sensor/emitter displacements may be costly andsize-prohibitive.

Implementations described herein provide interactance-based measurementsat multiple different penetration depths in a measurement target. Forexample, a sensor device may include one or more sensors and one or moreemitters. In some implementations, the sensor device may include asingle sensor and two or more emitters at different displacements fromthe single sensor. In some implementations, the sensor device mayinclude a single emitter and two or more sensors at differentdisplacements from the single emitter. In some implementations, thesensor device may include two or more sensors and two or more emitters,which enables measurements at four or more possible displacementsbetween sensor/emitter pairs. In some implementations, the sensor devicemay include one or more waveguides that guide light from differentmeasurement locations on a measurement target to one or more sensors,thereby achieving different displacements from a single emitter for asingle sensor. Thus, the spectra of multiple measurement depths can bemeasured by including multiple distances between one or more emittersand one or more sensors of a single sensor device, which may provide alower cost, lower resource consumption, and smaller size than usingmultiple sensor devices that are each associated with a respectivesensor/emitter displacement.

FIGS. 1-5 are diagrams of example implementations of sensor devices 100,200, 300, 400, and 500 described herein.

FIG. 1 shows an example implementation of a sensor device 100 thatincludes multiple emitters 110 and a single sensor 120. As shown, sensordevice 100 includes multiple emitters 110 (e.g., emitters 1 through N,where N is greater than 1), a single sensor 120, a filter 130corresponding to the sensor 120, and a processor 140.

Emitter 110 includes an optical transmitter (e.g., a light source) thattransmits an optical signal toward a measurement target (not shown). Theoptical signal may comprise multiple wavelength ranges of visible light,near-infrared light, mid-infrared light, and/or the like. In someimplementations, emitter 110 may include a light emitting diode (LED) oran array of LEDs.

Sensor 120 includes a device capable of performing a measurement oflight directed toward sensor 120 (e.g., via filter 130), such as anoptical sensor, a spectral sensor, an image sensor, and/or the like.Sensor 120 may utilize one or more sensor technologies, such as acomplementary metal-oxide-semiconductor (CMOS) technology, acharge-coupled device (CCD) technology, and/or the like. In someimplementations, sensor 120 may include multiple sensor elements (e.g.,an array of sensor elements—referred to as a sensor array) eachconfigured to obtain information. For example, a sensor element mayprovide an indication of intensity of light that is incident on thesensor element (e.g., active/inactive or a more granular indication ofintensity), such as an electrical signal.

Filter 130 includes a spectral filter, a multispectral filter, abandpass filter, a blocking filter, a long-wave pass filter, ashort-wave pass filter, a dichroic filter, a linear variable filter(LVF), a circular variable filter (CVF), a Fabry-Perot filter, a Bayerfilter, and/or the like. Filter 130 may pass one or more wavelengths oflight for sensing by sensor 120. In some implementations, filter 130 mayinclude multiple, different filters that are configured to passrespective spectral ranges to sensor 120. For example, filter 130 mayinclude a binary filter, such as a binary multispectral filter.

Processor 140 is described in more detail in connection with FIG. 8.

Emitters 110 of sensor device 100 may be spatially separated from eachother so as to achieve different displacements 150, 160, and 170relative to sensor 120. For example, Emitter 1 is associated with adisplacement D1, Emitter 2 is associated with a displacement D2, and soon, where each of these displacements is different than the otherdisplacements. The different displacements D1 through DN may enablemeasurement at different penetration depths by sensor 120. In someaspects, the displacements D1 through DN may be based on a penetrationdepth and/or a material composition of the material being measured. Forexample, a displacement of approximately 1 mm may be used for a shallowskin layer measurement, whereas a displacement of approximately 200 mmmay be used for a deep muscle measurement.

In some implementations, an emitter 110 associated with a largerdisplacement from sensor 120 may emit more optical power than an emitter110 associated with a smaller displacement from sensor 120. For example,Emitter 2 may use a higher transmission power than Emitter 1. This mayimprove measurement signal-to-noise ratio and enable the determinationof measurements at deeper penetration depths than if each emitter 110used the same transmission power.

Sensor device 100 may employ a variety of techniques, or a combinationof techniques, to differentiate the light transmitted by the emitters110 and/or the measurements determined using the light. For example,sensor device 100 may activate emitters 110 at different times or in aparticular pattern, and may determine measurements for emitters 110based on the times or the particular pattern. As another example,emitters 110 may emit light at different wavelengths, and filter 130 mayfilter the different wavelengths so that wavelengths corresponding todifferent emitters 110 are detected by different regions of sensor 120or at different times.

FIG. 2 shows an example implementation of a sensor device 200 thatincludes a single emitter 210 and multiple sensors 220. As shown, sensordevice 200 includes an emitter 210 (e.g., emitter 110), a plurality ofsensors 220 (e.g., Sensors 1 through N) (e.g., sensor 120), a pluralityof filters 230 (e.g., filter 130) corresponding to the plurality ofsensors 220, and a processor (e.g., processor 140). It should be notedthat some implementations described herein may not include filters 230,or the filtering function may be integrated with the sensor or performedby another component of sensor device 200 or another sensor devicedescribed herein.

As further shown, the plurality of sensors 220 are spaced from emitter210 at different displacements D1 through DN (shown by reference numbers240, 250, and 260). For example, D1 through DN may be different fromeach other, thereby enabling multi-distant spectral measurement of ameasurement target. In this case, a sensor 220 farther from emitter 210(e.g., with a larger displacement) may use a longer integration time fora measurement than a sensor 220 closer to emitter 210 (e.g., with asmaller displacement), which may improve a signal-to-noise ratio for thesensor 220 farther from emitter 210 due to the dimmer signal associatedwith the larger displacement.

FIG. 3 shows an example implementation 300 that includes a singleemitter 310 and a single sensor 320 with multiple sensing locationscorresponding to respective filters 330. As shown, sensor device 300includes an emitter 310 (e.g., emitter 110/210), a sensor 320 (e.g.,sensor 120/220), a plurality of filters 330 (e.g., filter 130/320), anda processor (e.g., processor 140). For example, sensor 320 may beassociated with a plurality of filters 330 (filters 1 through N). Eachfilter 330 may be associated with a respective displacement D1 throughDN (shown by reference numbers 340, 350, and 360). In some aspects, eachfilter 330 may cover or be associated with a respective sensing locationof sensor 320.

In some aspects, sensor 320 may include a single sensor. For example,sensor 320 may be monolithic and/or may be associated with a singleprocessor, a single backend, a single chip, and/or the like. This may beless costly than implementing a plurality of sensors. In some aspects,sensor 320 may be a composite of multiple sensors, such as a pluralityof sensors that are combined to form a sensor, which may be less complexthan implementing a single, larger sensor. Each filter 330 may beassociated with a respective sensing location. A sensing location maycorrespond to a range of pixels, an optical detector or set of opticaldetectors, and/or the like.

FIG. 4 shows an example implementation of a sensor device 400 thatincludes multiple emitters 410 and multiple sensors 420. As shown,sensor device 400 includes a plurality of emitters 410 (e.g., emitter110/210/310), a plurality of sensors 420 (e.g., sensor 120/220/320), aplurality of filters 430 (e.g., filter 130/230/330) corresponding to theplurality of sensors 420, and a processor (e.g., processor 140). Asfurther shown, the plurality of sensors 420 are spaced from theplurality of emitters 410 by respective displacements D11, D12, D21, andD22 (shown by reference numbers 440, 450, 460, and 470, respectively).D11 is a distance from Sensor 1 to Emitter 1, D12 is a distance fromSensor 1 to Emitter 2, D21 is a distance from Sensor 2 to Emitter 1, andD22 is a distance from Sensor 2 to Emitter 2. In some aspects, D11, D12,D21, and D22 may all be different from one another. In some aspects, atleast two of D11, D12, D21, and D22 may be equal to one another. Byimplementing multiple sensors and multiple emitters, the number ofdisplacements between sensors and emitters can be up to S×E, where S isa number of sensors and E is a number of emitters.

FIG. 5 shows an example implementation of a sensor device 500 includingoptical waveguides 510 and 520 that achieve multiple differentsensor/emitter displacements. As shown, sensor device 500 includesoptical waveguides 510 and 520, an emitter 530 (e.g., emitter110/210/310/410), a sensor 540 (e.g., sensor 120/220/320/420), one ormore filters 550 (e.g., filter 130/230/330/430), and one or morecollimators 560.

Optical waveguide 510/520 includes a device capable of guiding lightfrom one location to another location. For example, optical waveguide510/520 may include an optical pickup, a light pipe, an optical fiber,and/or the like. Collimator 560 is a device capable of collimating lightreceived via optical waveguide 510/520. For example, collimator 560 mayinclude collimating optics and/or the like. An optical waveguide 510/520may receive light generated by emitter 530 and may guide the light tocollimator 560. For example, and as shown, optical waveguide 510 mayguide light via a longer horizontal displacement than optical waveguide520, meaning that displacement D1, shown by reference number 570, islarger than displacement D2, shown by reference number 580. Thus, sensordevice 500 may achieve a variety of displacements using opticalwaveguides, which may allow for sensors and emitters to be provided in asmaller form factor. Furthermore, a plurality of displacements can beachieved using a single sensor that may be smaller than the sensor 320described in connection with FIG. 3, which may reduce power consumptionand simplify design. Furthermore, the filters 550 may be monolithic indesign, which may simplify fabrication and implementation.

In some aspects, a characteristic of a filter or a sensor may be basedon a displacement of the filter or sensor from an emitter. For example,a sensor associated with a larger displacement may be associated with alarger pixel size than a pixel size of a sensor associated with asmaller displacement, which may improve light collection to accommodatethe dimmer signal, and enable larger displacements. As another example,a filter associated with a larger displacement may be associated with awider filter channel to allow increased light collection, therebyaccommodating dimmer signals and enabling larger displacements.

A sensor device (e.g., sensor device 100/200/300/400/500) may use avariety of techniques, or a combination of techniques, to differentiatethe light transmitted by the emitters and/or the measurements determinedusing the light. For example, the sensor device may activate emitters atdifferent times or in a particular pattern, and may determinemeasurements for emitters based on the times or the particular pattern.As another example, emitters may emit light at different wavelengths,and a filter may filter the different wavelengths so that wavelengthscorresponding to different emitters are detected by different regions ofthe sensor or at different times.

By providing multiple different displacements between sensors andemitters, different penetration depths for measurements on a measurementtarget may be achieved. For example, as shown by example 600 of FIG. 6,at a given penetration depth, a larger spacing (where spacing is usedsynonymously with displacement), such as a spacing of 5 mm between thesensor and the emitter as indicated by the line shown by referencenumber 610, may provide a higher sensor flux than a smaller spacing,such as a spacing of 2.5 mm shown by reference number 620. Thus, bycombining smaller and larger displacements, improved performance at agiven penetration depth may be achieved, while also enablingmeasurements at a shallower penetration depth, such as a measurementconcurrent with the measurement at the given penetration depth.

As indicated above, FIGS. 1-6 are provided as one or more examples.Other examples may differ from what is described with regard to FIGS.1-6. Furthermore, any one or more of the devices shown in FIGS. 1-6 mayinclude one or more collimators or collimating optics similar tocollimator 560 of FIG. 5.

FIG. 7 is a diagram of an example environment 700 in which systemsand/or methods described herein may be implemented. As shown in FIG. 7,environment 700 may include a control device 710, a sensor device 720,and a network 730. Devices of environment 700 may interconnect via wiredconnections, wireless connections, or a combination of wired andwireless connections.

Control device 710 includes one or more devices capable of storing,processing, and/or routing information associated with spectroscopicmeasurement. For example, control device 710 may include a server, acomputer, a wearable device, a cloud computing device, and/or the like.In some implementations, control device 710 may be associated with aparticular sensor device 720. In some implementations, control device710 may be associated with multiple sensor devices 720. In someimplementations, control device 710 may receive information from and/ortransmit information to another device in environment 700, such assensor device 720.

Sensor device 720 includes one or more devices capable of performing aspectroscopic measurement on a sample. For example, sensor device 720may include a spectrometer device that performs spectroscopy (e.g.,vibrational spectroscopy, such as a near infrared (NIR) spectrometer, amid-infrared spectroscopy (mid-IR), Raman spectroscopy, and/or thelike). In some implementations, sensor device 720 may be incorporatedinto a wearable device, such as a wearable spectrometer and/or the like.In some implementations, sensor device 720 may receive information fromand/or transmit information to another device in environment 700, suchas control device 710. In some implementations, sensor device 720includes one or more of the components described in connection withsensor device 100/200/300/400/500.

Network 730 may include one or more wired and/or wireless networks. Forexample, network 730 may include a cellular network (e.g., a long-termevolution (LTE) network, a 3G network, a code division multiple access(CDMA) network, etc.), a public land mobile network (PLMN), a local areanetwork (LAN), a wide area network (WAN), a metropolitan area network(MAN), a telephone network (e.g., the Public Switched Telephone Network(PSTN)), a private network, an ad hoc network, an intranet, theInternet, a fiber optic-based network, a cloud computing network, and/orthe like, and/or a combination of these or other types of networks.

The number and arrangement of devices and networks shown in FIG. 7 areprovided as an example. In practice, there may be additional devicesand/or networks, fewer devices and/or networks, different devices and/ornetworks, or differently arranged devices and/or networks than thoseshown in FIG. 7. Furthermore, two or more devices shown in FIG. 7 may beimplemented within a single device, or a single device shown in FIG. 7may be implemented as multiple, distributed devices. For example,although control device 710 and sensor device 720 are described, herein,as being two separate devices, control device 710 and sensor device 720may be implemented within a single device. Additionally, oralternatively, a set of devices (e.g., one or more devices) ofenvironment 700 may perform one or more functions described as beingperformed by another set of devices of environment 700.

FIG. 8 is a diagram of example components of a device 800. Device 800may correspond to control device 710 and sensor device 720. In someimplementations, control device 710 and/or sensor device 720 may includeone or more devices 800 and/or one or more components of device 800. Asshown in FIG. 8, device 800 may include a bus 810, a processor 820, amemory 830, a storage component 840, an input component 850, an outputcomponent 860, and a communication interface 870.

Bus 810 includes a component that permits communication among multiplecomponents of device 800. Processor 820 is implemented in hardware,firmware, and/or a combination of hardware and software. Processor 820is a central processing unit (CPU), a graphics processing unit (GPU), anaccelerated processing unit (APU), a microprocessor, a microcontroller,a digital signal processor (DSP), a field-programmable gate array(FPGA), an application-specific integrated circuit (ASIC), or anothertype of processing component. In some implementations, processor 820includes one or more processors capable of being programmed to perform afunction. Memory 830 includes a random access memory (RAM), a read onlymemory (ROM), and/or another type of dynamic or static storage device(e.g., a flash memory, a magnetic memory, and/or an optical memory) thatstores information and/or instructions for use by processor 820.

Storage component 840 stores information and/or software related to theoperation and use of device 800. For example, storage component 840 mayinclude a hard disk (e.g., a magnetic disk, an optical disk, and/or amagneto-optic disk), a solid state drive (SSD), a compact disc (CD), adigital versatile disc (DVD), a floppy disk, a cartridge, a magnetictape, and/or another type of non-transitory computer-readable medium,along with a corresponding drive.

Input component 850 includes a component that permits device 800 toreceive information, such as via user input (e.g., a touch screendisplay, a keyboard, a keypad, a mouse, a button, a switch, and/or amicrophone). Additionally, or alternatively, input component 850 mayinclude a component for determining location (e.g., a global positioningsystem (GPS) component) and/or a sensor (e.g., an accelerometer, agyroscope, an actuator, another type of positional or environmentalsensor, and/or the like). Output component 860 includes a component thatprovides output information from device 800 (via, e.g., a display, aspeaker, a haptic feedback component, an audio or visual indicator,and/or the like).

Communication interface 870 includes a transceiver-like component (e.g.,a transceiver, a separate receiver, a separate transmitter, and/or thelike) that enables device 800 to communicate with other devices, such asvia a wired connection, a wireless connection, or a combination of wiredand wireless connections. Communication interface 870 may permit device800 to receive information from another device and/or provideinformation to another device. For example, communication interface 870may include an Ethernet interface, an optical interface, a coaxialinterface, an infrared interface, a radio frequency (RF) interface, auniversal serial bus (USB) interface, a wireless local area networkinterface, a cellular network interface, and/or the like.

Device 800 may perform one or more processes described herein. Device800 may perform these processes based on processor 820 executingsoftware instructions stored by a non-transitory computer-readablemedium, such as memory 830 and/or storage component 840. As used herein,the term “computer-readable medium” refers to a non-transitory memorydevice. A memory device includes memory space within a single physicalstorage device or memory space spread across multiple physical storagedevices.

Software instructions may be read into memory 830 and/or storagecomponent 840 from another computer-readable medium or from anotherdevice via communication interface 870. When executed, softwareinstructions stored in memory 830 and/or storage component 840 may causeprocessor 820 to perform one or more processes described herein.Additionally, or alternatively, hardware circuitry may be used in placeof or in combination with software instructions to perform one or moreprocesses described herein. Thus, implementations described herein arenot limited to any specific combination of hardware circuitry andsoftware.

The number and arrangement of components shown in FIG. 8 are provided asan example. In practice, device 800 may include additional components,fewer components, different components, or differently arrangedcomponents than those shown in FIG. 8. Additionally, or alternatively, aset of components (e.g., one or more components) of device 800 mayperform one or more functions described as being performed by anotherset of components of device 800.

FIG. 9 is a flow chart of an example process 900 for determiningmeasurements at two or more different measurement depths based on two ormore separations between sensors and emitters. In some implementations,one or more process blocks of FIG. 9 may be performed by a sensor device(e.g., sensor device 100/200/300/400/500/720). In some implementations,one or more process blocks of FIG. 9 may be performed by another deviceor a group of devices separate from or including the sensor device, suchas control device 710 and/or the like. In some aspects, the sensordevice includes one or more optical sensors.

As shown in FIG. 9, process 900 may include determining a first opticalsensor value associated with a first displacement and a second opticalsensor value associated with a second displacement (block 910). Forexample, the sensor device (e.g., using processor 140/820, sensor120/220/320/420/540, and/or the like) may determine a first opticalsensor value associated with a first displacement and a second opticalsensor value associated with a second displacement, as described above.In some implementations, the first displacement is between an emitterassociated with the first optical sensor value and a sensing locationused to determine the first optical sensor value, and the seconddisplacement is between an emitter associated with the second opticalsensor value and a sensing location used to determine the second opticalsensor value. In some implementations, the first displacement isdifferent from the second displacement.

As further shown in FIG. 9, process 900 may include determining one ormore measurements using the first optical sensor value and the secondoptical sensor value, wherein the one or more measurements relate to afirst penetration depth associated with the first optical sensor value,and a second penetration depth associated with the second optical sensorvalue (block 920). For example, the sensor device (e.g., using processor140/820, memory 830, storage component 840, and/or the like) maydetermine one or more measurements using the first optical sensor valueand the second optical sensor value, as described above. In someimplementations, the one or more measurements relate to a firstpenetration depth associated with the first optical sensor value, and asecond penetration depth associated with the second optical sensorvalue. For example, the one or more measurements may include respectivespectrometry measurements, health-related measurements, and/or the like.

As further shown in FIG. 9, process 900 may include providinginformation identifying the one or more measurements (block 930). Forexample, the sensor device (e.g., using processor 140/820, memory 830,storage component 840, input component 850, output component 860,communication interface 870 and/or the like) may provide informationidentifying the one or more measurements, as described above. In someimplementations, the sensor device may provide the informationidentifying the one or more measurements to a control device, forstorage by the sensor device, via a user interface, and/or the like.

Process 900 may include additional implementations, such as any singleimplementation or any combination of implementations described belowand/or in connection with one or more other processes describedelsewhere herein.

In a first implementation, the emitter associated with the first opticalsensor value and the emitter associated with the second optical sensorvalue are a same emitter.

In a second implementation, alone or in combination with the firstimplementation, the emitter associated with the first optical sensorvalue and the emitter associated with the second optical sensor valueare different emitters.

In a third implementation, alone or in combination with one or more ofthe first and second implementations, the sensing location used todetermine the first optical sensor value and the sensing location usedto determine the second optical sensor value are a same sensinglocation.

In a fourth implementation, alone or in combination with one or more ofthe first through third implementations, the sensing location used todetermine the first optical sensor value and the sensing location usedto determine the second optical sensor value are different sensinglocations.

In a fifth implementation, alone or in combination with one or more ofthe first through fourth implementations, the emitter associated withthe first optical sensor value and the emitter associated with thesecond optical sensor value are a same emitter, and the first opticalsensor value and the second optical sensor value are determined using asingle optical sensor.

In a sixth implementation, alone or in combination with one or more ofthe first through fifth implementations, the first displacement isgreater than the second displacement, and the first optical sensor valueis determined using an integration time that is longer than anintegration time used to determine the second optical sensor value.

In a seventh implementation, alone or in combination with one or more ofthe first through sixth implementations, the first displacement isgreater than the second displacement, and the emitter associated withthe first optical sensor value uses a greater transmission power than atransmission power used by the emitter associated with the secondoptical sensor value.

In an eighth implementation, alone or in combination with one or more ofthe first through seventh implementations, the one or more measurementscomprise one or more spectroscopy measurements.

In a ninth implementation, alone or in combination with one or more ofthe first through eighth implementations, the sensor device includes afirst optical waveguide connecting the sensing location used todetermine the first optical sensor value and an optical sensor of theone or more optical sensors, and a second optical waveguide connectingthe sensing location used to determine the second optical sensor valueand the optical sensor.

In a tenth implementation, alone or in combination with one or more ofthe first through ninth implementations, the sensor device includes afirst optical filter associated with an optical sensor of the one ormore optical sensors, and a second optical filter associated with theoptical sensor, wherein the first optical filter corresponds to thesensing location associated with the first optical sensor value and thesecond optical filter corresponds to the sensing location associatedwith the second optical sensor value.

In an eleventh implementation, alone or in combination with one or moreof the first through tenth implementations, the first optical filter andthe second optical filter cover different regions of the optical sensor.

In a twelfth implementation, alone or in combination with one or more ofthe first through eleventh implementations, the first optical filter isconfigured to filter light from the first optical waveguide and thesecond optical filter is configured to filter light from the secondoptical waveguide.

In a thirteenth implementation, alone or in combination with one or moreof the first through twelfth implementations, the one or more opticalsensors are a single optical sensor.

In a fourteenth implementation, alone or in combination with one or moreof the first through thirteenth implementations, the one or more opticalsensors comprise a single optical sensor, and the emitter used todetermine the first optical sensor value and the emitter used todetermine the second optical sensor value are different emitters.

In a fifteenth implementation, alone or in combination with one or moreof the first through fourteenth implementations, the one or more opticalsensors comprise a plurality of optical sensors, and the emitter used todetermine the first optical sensor value and the emitter used todetermine the second optical sensor value comprise a same emitter.

In a sixteenth implementation, alone or in combination with one or moreof the first through fifteenth implementations, the one or more opticalsensors comprise a plurality of optical sensors, and the emitter used todetermine the first optical sensor value and the emitter used todetermine the second optical sensor value are different emitters.

In a seventeenth implementation, alone or in combination with one ormore of the first through sixteenth implementations, each optical sensorof the plurality of optical sensors is associated with a respectivefilter.

In an eighteenth implementation, alone or in combination with one ormore of the first through seventeenth implementations, the sensor deviceincludes one or more collimators used to collimate light for determiningthe first optical sensor value and the second optical sensor value.

Although FIG. 9 shows example blocks of process 900, in someimplementations, process 900 may include additional blocks, fewerblocks, different blocks, or differently arranged blocks than thosedepicted in FIG. 9. Additionally, or alternatively, two or more of theblocks of process 900 may be performed in parallel.

The foregoing disclosure provides illustration and description, but isnot intended to be exhaustive or to limit the implementations to theprecise forms disclosed. Modifications and variations may be made inlight of the above disclosure or may be acquired from practice of theimplementations.

As used herein, the term “component” is intended to be broadly construedas hardware, firmware, and/or a combination of hardware and software.

As used herein, satisfying a threshold may, depending on the context,refer to a value being greater than the threshold, more than thethreshold, higher than the threshold, greater than or equal to thethreshold, less than the threshold, fewer than the threshold, lower thanthe threshold, less than or equal to the threshold, equal to thethreshold, or the like.

It will be apparent that systems and/or methods described herein may beimplemented in different forms of hardware, firmware, or a combinationof hardware and software. The actual specialized control hardware orsoftware code used to implement these systems and/or methods is notlimiting of the implementations. Thus, the operation and behavior of thesystems and/or methods are described herein without reference tospecific software code—it being understood that software and hardwarecan be designed to implement the systems and/or methods based on thedescription herein.

Even though particular combinations of features are recited in theclaims and/or disclosed in the specification, these combinations are notintended to limit the disclosure of various implementations. In fact,many of these features may be combined in ways not specifically recitedin the claims and/or disclosed in the specification. Although eachdependent claim listed below may directly depend on only one claim, thedisclosure of various implementations includes each dependent claim incombination with every other claim in the claim set.

No element, act, or instruction used herein should be construed ascritical or essential unless explicitly described as such. Also, as usedherein, the articles “a” and “an” are intended to include one or moreitems, and may be used interchangeably with “one or more.” Further, asused herein, the article “the” is intended to include one or more itemsreferenced in connection with the article “the” and may be usedinterchangeably with “the one or more.” Furthermore, as used herein, theterm “set” is intended to include one or more items (e.g., relateditems, unrelated items, a combination of related and unrelated items,etc.), and may be used interchangeably with “one or more.” Where onlyone item is intended, the phrase “only one” or similar language is used.Also, as used herein, the terms “has,” “have,” “having,” or the like areintended to be open-ended terms. Further, the phrase “based on” isintended to mean “based, at least in part, on” unless explicitly statedotherwise. Also, as used herein, the term “or” is intended to beinclusive when used in a series and may be used interchangeably with“and/or,” unless explicitly stated otherwise (e.g., if used incombination with “either” or “only one of”).

What is claimed is:
 1. A sensor device, comprising: a first opticalwaveguide to guide first light from a first location; a second opticalwaveguide to guide second light from a second location; a firstcollimator to collimate the first light received via the first opticalwaveguide; a second collimator to collimate the second light receivedvia the second optical waveguide; a sensor; and one or more filtersbetween the sensor and one or more of the first collimator or the secondcollimator.
 2. The sensor device of claim 1, further comprising: anemitter to generate the first light and the second light.
 3. The sensordevice of claim 2, wherein a first displacement between a locationassociated with the emitter and the first location is longer than asecond displacement between the location associated with the emitter andthe second location.
 4. The sensor device of claim 1, wherein the firstoptical waveguide guides the first light via a longer horizontaldisplacement than the second optical waveguide guides the second light.5. The sensor device of claim 1, wherein the sensor device includes onlya single sensor, and wherein the sensor is the single sensor.
 6. Thesensor device of claim 1, wherein the sensor device includes only asingle emitter.
 7. The sensor device of claim 1, wherein the firstoptical waveguide is a first light pipe, and wherein the second opticalwaveguide is a second light pipe.
 8. The sensor device of claim 1,wherein the one or more filters comprise: a first filter between thesensor and the first collimator, and a second filter between the sensorand the second collimator.
 9. A device, comprising: one or more opticalwaveguides to guide light; one or more collimators to collimate thelight received via the one or more optical waveguides; one or moresensors; and one or more filters between the sensor and the one or morecollimators.
 10. The device of claim 9, wherein the one or more opticalwaveguides include one or more of an optical pickup, a light pipe, or anoptical fiber.
 11. The device of claim 9, wherein the one or moreoptical waveguides comprise: a first optical waveguide that guides afirst portion of the light, and a second optical waveguide that guides asecond portion of the light via a longer horizontal displacement thanthe first optical waveguide.
 12. The device of claim 9, furthercomprising: one or more emitters to emit the light at differentwavelengths.
 13. The device of claim 9, further comprising: one or moreemitters configured to be activated at different times or in aparticular pattern.
 14. The device of claim 9, wherein the deviceincludes only a single emitter.
 15. A device, comprising: a firstoptical waveguide to guide first light from a first location; a secondoptical waveguide to guide second light from a second location; a firstcollimator to collimate the first light received via the first opticalwaveguide; a second collimator to collimate the second light receivedvia the second optical waveguide; and a sensor.
 16. The device of claim15, further comprising: an emitter to generate the first light and thesecond light.
 17. The device of claim 15, wherein a first displacementassociated with the first optical waveguide is longer than a seconddisplacement associated with the second optical waveguide.
 18. Thedevice of claim 15, wherein the device includes only a single sensor,and wherein the sensor is the single sensor.
 19. The device of claim 15,wherein the device includes only a single emitter.
 20. The device ofclaim 15, further comprising: a first filter between the sensor and thefirst collimator, and a second filter between the sensor and the secondcollimator.